Intel Showcases Technology For Next Era Of Computing At CES 2019

The chip giant, Intel has showcased numerous CCG developments at CES 2019, including its latest Intel Xeon Scalable products with advanced AI and memory capabilities and 9th Gen Intel Core desktop products.

At CES 2019, Intel made several announcements spanning PCs and new devices to diverse growth segments including artificial intelligence (AI), 5G and autonomous driving (AD).
 
The chip giant showcased numerous CCG developments including its latest Intel Xeon Scalable products with advanced AI and memory capabilities and 9th Gen Intel Core desktop products. It also announced new 10nm products for PCs, servers and 5G wireless access base stations, the future of new chip designs based on its 3D packaging technology (Foveros).
 
According to the company, Mobileye is working with Ordnance Survey to bring us closer to the realization of smart cities and safer roads.
 
New mobile PC platform with “Ice Lake”: Intel assert that the vision for tomorrow’s mobile PC platform is firmly aligned with the corporation’s upcoming first volume 10nm PC processor, code-named “Ice Lake”.
 
Ice Lake, according to Intel, will bring a new level of integration with the corporation’s new Sunny Cove microarchitecture — which will accelerate AI usage and a graphics engine — and Intel Gen11 graphics to improve graphics performance for richer gaming and content creation experiences.
 
Project Athena: The company also announced Project Athena which according to the company is an innovation program developed to help usher in a new class of advanced laptops, which are designed to enable new experiences and capitalize on next-generation technologies, including 5G and artificial intelligence.
 
The corporation delivered the first PC with integrated Wi-Fi in the Intel Centrino platform and helped drive super thin and light designs, touchscreens, and 2 in 1 form factors with Ultrabook into the mainstream.
 
The company believes it is uniquely positioned to be the catalyst in delivering the next-gen PC experience. Coupling world-class performance, battery life, and connectivity in sleek, beautiful designs, the first Project Athena devices will ship in the second half of this year.
 
Source: Intel 
 
“Lakefield” preview: The company also gave a sneak peek of a new client platform, code-named "Lakefield" that features a hybrid CPU architecture with Intel's new innovative Foveros 3D packaging technology. Lakefield has five cores, combining a 10nm high-performance Sunny Cove core with four Intel Atom processor-based cores into a tiny package that delivers low-power efficiency with graphics and other IPs, I/O and memory. 
 
Expanding 9th Gen Intel Core Processor Family: In October, Intel launched the first set of the 9th Gen Core desktop processors, including the Intel Core i9-9900K processor. At the CES pre-show, Intel introduced new additions to the 9th Gen Intel Core desktop processor family that expand the options to meet a broad range of consumer needs from casual users to professionals to gamers and serious content creators.
 
Other highlights of the session included 10nm server processor preview:, Expanding 5G with 10nm SoCs and Release of next-generation Intel Xeon Scalable processors.
 
To know more, you can visit the official press release here.